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Questions about our engineering services

Questions about the engineering services or consulting services we offer can rarely be answered briefly and concisely. Often several telephone calls or emails are necessary just for the submission of an offer in order to sufficiently clarify the respective task. But also during project work problems occur again and again, which may [...] Read More

Indoor climate assessment using CFD simulation

CFD simulation is also used to evaluate the indoor climate, for example for office buildings, but also for other buildings, such as factory buildings. The CFD calculation maps the room to be analysed including all supply and exhaust air systems. The CFD analysis thus illustrates the temperature and flow velocities in the respective room. Click [...] Read More

CFD simulation for electronic cooling

The CFD simulation for an electronics cooling system is used when heat emitted by electronic components must be efficiently dissipated to the environment. In contrast to the thermal simulation of electronic components, the CFD calculation for electronics cooling also takes into account the heat emitted by the ambient air. The CFD analysis for electronics cooling, for example, makes it possible to investigate whether fans and cooling fans are able to [...] Read More

FE analysis of rubber and plastic components

Linear-elastic material models are generally unsuitable for the FEM calculation of rubber or plastic components. Small strains are assumed for linear calculations. When calculating the strength of rubber or hyper-elastic plastics, we must assume both high strains and non-linear material behaviour. The correct selection of the material model and the corresponding [...] Read More

Thermal and thermoelectric analysis of electronic components

Thermal analysis and thermoelectric analysis are used to investigate frequently occurring temperature distribution in electronic components. Thus it can be determined already in the development stage whether the amount of heat introduced during operation can cause damage to boards or chips. The heat is distributed in the model by heat conduction or is dissipated by fans or heat sinks with the help of [...] Read More
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