Through thermoanalysis and thermoelectric analysis one examines frequently occurring temperature distribution in electronic components. In this way, it can be determined at the development stage whether the amount of heat introduced during operation can cause damage to circuit boards or chips. The heat is distributed in the model by heat conduction or is dissipated by fans or heat sinks by means of free or forced convection. For the thermal simulation on the other hand, it is assumed that there is no current flow but rather heat input and thus heat is generated during operation of the component. Learn more about this, how to improve the function and quality of your products with the help of thermal simulations can.