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Thermal and thermoelectric analysis of electronic components

Through thermoanalysis and thermoelectric analysis one examines frequently occurring temperature distribution in electronic components. In this way, it can be determined at the development stage whether the amount of heat introduced during operation can cause damage to circuit boards or chips. The heat is distributed in the model by heat conduction or is dissipated by fans or heat sinks by means of free or forced convection. For the thermal simulation on the other hand, it is assumed that there is no current flow but rather heat input and thus heat is generated during operation of the component. Learn more about this, how to improve the function and quality of your products with the help of thermal simulations can.

Stationary thermal analysis

The stationary thermal analysis depicts the steady state (stable) condition in continuous operation. The example in the figure shows a stationary thermal simulation of a workstation in continuous operation and the corresponding heat distribution in CPU, RAM, graphics card and heat sinks.

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Thermal transient analysis when viewing electronic components

Thermal transient simulation is used, for example, to investigate the effects of component overheating on adjacent components. Usually, a component whose failure is to be simulated is heated up strongly within a very short time. Subsequently, the consequential damage and effects on neighbouring components are analysed on the basis of heat dissipation and heat conduction.

Thermoelectric analysis for the observation of electrical contacts

In thermoelectric calculation, heat is generated by the flow of current. This makes it possible, for example, to investigate the heat development at electrical contacts or conductor cross-sections.

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