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Thermal and thermoelectric analysis of electronic components
March 16, 2018.
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Simulation and calculation , Thermal simulation, thermoelectric simulation and thermodynamic simulation -
by admin
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Thermal analysis and thermoelectric analysis are used to investigate frequently occurring temperature distribution in electronic components. Thus it can be determined already in the development stage whether the amount of heat introduced during operation can cause damage to boards or chips. The heat is distributed in the model by heat conduction or is dissipated by fans or heat sinks with the help of [...] Read More
CFD calculation on labyrinth seals
For CFD calculations on labyrinth gap seals, both 2D and 3D geometries were considered within the framework of a CFD parameter study. This type of seal is a non-contact seal. The sealing effect is based on an extension of the flow path through the gap to be sealed. They are usually used in almost all types of turbomachinery and [...] Read MoreFSI simulation of a cylinder head
15 September 2017
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Mechanics simulation , Simulation and calculation , Flow simulation -
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The FSI simulation (fluid-structure interaction) describes the interactions between mechanics and flow on the components under consideration. CFD analysis and FE analysis are coupled together. In this simulation example, the influence of air cooling by heat conduction and heat transfer at the cylinder head on the mechanical stresses, deformations and forces in the component is to be investigated. For the execution of the [...] Read More
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