Category: Simulation and calculation
FEM example: Calculation of a pedestrian bridge
This FEM example from practice for the static calculation of a pedestrian bridge was developed within the framework of a non-profit project in cooperation with the company Kirchgässner Elektrotechnik GmbH, with whom we have a long-standing partnership. Kirchgässner Elektrotechnik GmbH is a strongly expanding family business with headquarters in Binau and the right contact for [...] Read MoreIndoor climate assessment using CFD simulation
CFD simulation is also used to evaluate the indoor climate, for example for office buildings, but also for other buildings, such as factory buildings. The CFD calculation maps the room to be analysed including all supply and exhaust air systems. The CFD analysis thus illustrates the temperature and flow velocities in the respective room. Click [...] Read MoreCFD simulation for electronic cooling
The CFD simulation for an electronics cooling system is used when heat emitted by electronic components must be efficiently dissipated to the environment. In contrast to the thermal simulation of electronic components, the CFD calculation for electronics cooling also takes into account the heat emitted by the ambient air. The CFD analysis for electronics cooling, for example, makes it possible to investigate whether fans and cooling fans are able to [...] Read MoreFE analysis of rubber and plastic components
Linear-elastic material models are generally unsuitable for the FEM calculation of rubber or plastic components. Small strains are assumed for linear calculations. When calculating the strength of rubber or hyper-elastic plastics, we must assume both high strains and non-linear material behaviour. The correct selection of the material model and the corresponding [...] Read MoreThermal and thermoelectric analysis of electronic components
March 16, 2018.
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Simulation and calculation , Thermal simulation, thermoelectric simulation and thermodynamic simulation -
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Thermal analysis and thermoelectric analysis are used to investigate frequently occurring temperature distribution in electronic components. Thus it can be determined already in the development stage whether the amount of heat introduced during operation can cause damage to boards or chips. The heat is distributed in the model by heat conduction or is dissipated by fans or heat sinks with the help of [...] Read More
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